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SST32HF162 Datasheet - Silicon Storage Technology

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Part Name
SST32HF162

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28 Pages

File Size
318.9 kB

MFG CO.
SST
Silicon Storage Technology 

PRODUCT DESCRIPTION
The SST32HF802/162/164 ComboMemory devices integrate a 512K x16 or 1M x16 CMOS flash memory bank with a 128K x16 or 256K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology.


FEATURES:
• MPF + SRAM ComboMemory
    – SST32HF802: 512K x16 Flash + 128K x16 SRAM
    – SST32HF162: 1M x16 Flash + 128K x16 SRAM
    – SST32HF164: 1M x16 Flash + 256K x16 SRAM
• Single 2.7-3.3V Read and Write Operations
• Concurrent Operation
    – Read from or write to SRAM while Erase/Program Flash
• Superior Reliability
    – Endurance: 100,000 Cycles (typical)
    – Greater than 100 years Data Retention
• Low Power Consumption:
    – Active Current: 15 mA (typical) for Flash or SRAM Read
    – Standby Current: 20 µA (typical)
• Flexible Erase Capability
    – Uniform 2 KWord sectors
    – Uniform 32 KWord size blocks
• Fast Read Access Times:
    – Flash: 70 ns and 90 ns
    – SRAM: 70 ns and 90 ns
• Latched Address and Data for Flash
• Flash Fast Erase and Word-Program:
    – Sector-Erase Time: 18 ms (typical)
    – Block-Erase Time: 18 ms (typical)
    – Chip-Erase Time: 70 ms (typical)
    – Word-Program Time: 14 µs (typical)
    – Chip Rewrite Time:
        SST32HF802: 8 seconds (typical)
        SST32HF162/164: 15 seconds (typical)
• Flash Automatic Erase and Program Timing
    – Internal VPP Generation
• Flash End-of-Write Detection
    – Toggle Bit
    – Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard Command Set
• Package Available
    – 48-lead TSOP (12mm x 20mm)
    – 48-ball TBGA (10mm x 12mm)

Page Link's: 1  2  3  4  5  6  7  8  9  10  More Pages 

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