Features
● Low profile package
● Ideal for automated placement
● Ultrafast reverse recovery time
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date
● Case: JEDEC DO-214AA molded plastic
   body over passivated chip
● Terminals: Solder plated, solderable per
   J-STD-002B and JESD22-B102D
● Polarity: Laser band denotes cathode end