[MDE-Semiconductor]

FEATURES
• For surface mounted applications in order to optimize board space
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Excellent clamping capability
• Repetition rate (duty cycle):0.01%
• Fast response time: typically less than 1.0 ps from 0 volts to BV for unidirectional types
• Typical IR less than 1µA above 10V
• High temperature soldering: 250°C/10 seconds at terminals
• Plastic package has Underwriters Laboratory Flammability Classification 94 V-O