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S1ABF PDF
S1ABF Datasheet - DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
MFG CO.

DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
FEATURES
• For surface mounted applications
• Low profile package
• Glass Passivated Chip Junction
• Easy to pick and place
• Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
• Case: SMBF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 57mg / 0.002oz
Part Name
Description
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DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD