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RS3MF PDF
RS3MF Datasheet - Shanghai Yint Electronic Co., Ltd.
MFG CO.
Shanghai Yint Electronic Co., Ltd.
Features
● For surface mounted applications
● Low profile package
● Glass Passivated Chip Junction
● Easy to pick and place
● Fast reverse recovery time
● Lead free in comply with EU RoHS 2011/65/EU directives
Mechanical Data
● Case: SMAF
● Terminals: Solderable per MIL-STD-750, Method 2026
● Approx. Weight: 27mg / 0.00095oz
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