Features
● Low profile package
● Ideal for automated placement
● Glass passivated chip junction
● Fast switching for high efficiency
● High forward surge capability
● High temperature soldering˖
   260°C/10 seconds at terminals
● Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date
● Case: JEDEC DO-214AB molded plastic
   over glass passivated chip
● Terminals: Solder plated, solderable per
   J-STD-002B and JESD22-B102D
● Polarity: Laser band denotes cathode end