FEATURES
● PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical ≤ 2%, Max. ≤ 10% of Die Area)
● EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
● LOW FORWARD VOLTAGE DROP
● 3A at T­A= 55 °C WITH NO THERMAL RUNAWAY