Part Name
MMSZ5241
Description
Other PDF
no available.
PDF
page
3 Pages
File Size
219.9 kB
MFG CO.

Shanghai Leiditech Electronic Technology Co., Ltd
Features
● For surface mounted applications
in order to optimize board space
● Low profile space
● Glass passivated chip
● High reliability
● For use in stabilizing and clipping
circuits with high power rating
● Component in accordance to
RoHS 2002/95/EC and WEEE 2002/96/EC
APPLICATIONs
● Voltage stabilization
Mechanical Date
● Case: JEDEC SOD-123FL molded plastic
body over glass passivated chip
● Terminals: Solder plated, solderable per
MIL-STD-750 Method 2026
● Polarity: types the band by laser
denotes the cathode
● Weight: 0.017gram