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MMSZ5221B Datasheet - UN Semiconducctor INC

MMSZ52XXB image

Part Name
MMSZ5221B

Other PDF
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PDF
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page
6 Pages

File Size
775.7 kB

MFG CO.
UNSEMI
UN Semiconducctor INC 

Features
✦ Planar Die Construction
✦ Ultra-Small Surface Mount Package
✦ General purpose, Medium Current
✦ 350mW Power Dissipation On Ceramic PBC
✦ Ideally Suited for Automated Assembly Processes

Mechanical Data
✦ Case: SOD-123
✦ Molding Compound Flammability Rating : UL 94V-O
✦ Quantity Per Reel : 3,000pcs
✦ Lead Finish : Lead Free


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