Part Name
MM018-06
Other PDF
no available.
PDF
page
3 Pages
File Size
89.5 kB
MFG CO.

Microsemi Corporation
Features
● Available in Low Conduction Loss Class as MM118-xxL or Fast Switching Class as MM118-xxF
● Compact and rugged construction offering weight and space savings
● Available with PC board solderable pins (see mechanical outline below) or threaded terminals (add “T”suffix to part number, see option below)
● HPM (Hermetic Power Module)
● Isolation voltage capability (in reference to the base) in excess of 3kV · Very low thermal resistance
● Thermally matched construction provides excellent temperature and power cycling capability
● Additional voltage ratings or terminations available upon request