MLF2012D47NMT(2007) Datasheet - TDK Corporation
MFG CO.

TDK Corporation
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of compact circuits with high packing density.
• Excellent solderability and high heat resistance permits either flow or reflow soldering.
• The products contain no lead and also support lead-free soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or various electronic appliances.
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