DESCRIPTION
The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP.
The stacked structure of TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required.
This is a socket-type memory module ,suitable for easy interchange or addition of module.

FEATURES
• Utilizes industry standard 16M x 4 RAMs TSOP and industry standard input buffer in TSSOP
• 168-pin (84-pin dual dual in-line package) stacked structure
• Single 3.3V(+/- 0.3V) supply operation
• Low stand-by power dissipation . . . . . . . . . . 64.9mW(Max)
• Low operation power dissipation
   MH32V7245BST -5 . . . . . . . . . . . . . . . . . . 8.44W(Max)
   MH32V7245BST -6 . . . . . . . . . . . . . . . . . . 7.79W(Max)
• All input are directly LVTTL compatible
• All output are three-state and directry LVTTL compatible
• Includes(0.22 uF x 38) decoupling capacitors
• 4096 refresh cycle every 64ms (A0 - A11)
• Hyper-page mpde,Read-modify-write,/CAS before /RAS refresh, Hidden refresh capabilities
• JEDEC standard pin configration & Buffered PD pin
• Buffered input except /RAS and DQ
• Gold plating contact pads

APPLICATION
   Main memory unit for computers , Microcomputer memory