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LSGT770-J+L Datasheet - Infineon Technologies

LSGT770 image

Part Name
LSGT770-J+L

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10 Pages

File Size
98.4 kB

MFG CO.
Infineon
Infineon Technologies 

Features
• package: white P-LCC-4 package
• feature of the device: 2 chips can be controlled separately; LED is mounted top down and emits through the PCB
• wavelength: 628 nm (super-red), 570 nm (green)
• viewing angle: Lambertian Emitter (120°)
• technology: GaAlP
• optical efficiency: 1.5 lm/W (super-red), 2.5 lm/W (green)
• grouping parameter: luminous intensity
• assembly methods: suitable for all SMT assembly methods
• soldering methods: IR reflow soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 12-mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mm


APPLICATIONs
• optical indicators
• coupling into light guides
• backlighting (LCD, switches, cellular phones, keys, displays, illuminated advertising, general lighting)
• interior automotive lighting (e.g. dashboard backlighting, etc.)
• displays in- and outdoor

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