FEATURES:
• Chip Outline Dimensions: 68 x 68 mils
• Chip Thickness: 8 to 12 mils
• Anode Metallization: Aluminum
• Metallization Thickness: 70,000Ã Nominal
• Bonding Area: 42 x 42 mils Min.
• Back Metallization: Gold-3000Ã Nominal
• Junction Passivated with Thermal Silicon Dioxide - Planar Design
• Backside Available with Solderable Ag Backside as
   JANHCF or JANKCF