Part Name
IRF520NS
Description
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MFG CO.

Kersemi Electronic Co., Ltd.
Description
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the high est power capability and the lowest pos sible on-resistance in any existing surfa ce mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surf ace mount application. The through-hole version (IRF520NL) is available for low-pr ofile applications.
● Advanced Process Technology
● Surface Mount (IRF520NS)
● Low-profile through-hole (IRF520NL)
● 175°C Operating Temperature
● Fast Switching
● Fully Avalanche Rated