
Integrated Device Technology
DESCRIPTION:
The FCT163244/A/C 16-bit buffer/line drivers are built using advanced dual metal CMOS technology. These high speed, low-power devices offer bus/backplane interface capability with improved packing density. These devices have a flow-through organization for simplifying board layout. The three-state controls operate these devices in a Quad-Nibble, Dual-Byte or single 16-bit word mode. All inputs are designed with hysteresis for improved noise margin.
FEATURES:
• 0.5 MICRON CMOS Technology
• Typical tSK(o) (Output Skew) < 250ps
• ESD > 2000V per MIL-STD-883, Method 3015;
> 200V using machine model (C = 200pF, R = 0)
• Packages include 25 mil pitch SSOP, 19.6 mil pitch
TSSOP and 15.7 mil pitch TVSOP
• Extended commercial range of -40°C to +85°C
• VCC = 3.3V ±0.3V, Normal Range or
VCC = 2.7 to 3.6V, Extended Range
• CMOS power levels (0.4µW typ. static)
• Rail-to-Rail output swing for increased noise margin
• Low Ground Bounce (0.3V typ.)
• Inputs (except I/O) can be driven by 3.3V or 5V
components