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HS3G Datasheet - Shenzhen Luguang Electronic Technology Co., Ltd
MFG CO.

Shenzhen Luguang Electronic Technology Co., Ltd
Features
✧ Glass passivated junction chip.
✧ For surface mounted application
✧ Low forward voltage drop
✧ Low profile package
✧ Built-in stain relief, ideal for automatic
placement
✧ Fast switching for high efficiency
✧ High temperature soldering:
260°C/10 seconds at terminals
✧ Plastic material used carries Underwriters
Laboratory Classification 94V0
Mechanical Data
✧ Cases: Molded plastic
✧ Terminals: Pure tin plated, lead free
✧ Polarity: Indicated by cathode band
✧ Weight: 0.21 gram
Part Name
Description
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