FEATURES
• PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
• VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION
    (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
• EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
• LOW FORWARD VOLTAGE DROP
• 4A at TA = 75 °C C WITH NO THERMAL RUNAWAY