Features
1. Side lead ultra-compact transmission type
2. Conforming to solder reflow
    Pre-heat : 160 ˚C, MAX. 120 sec
    Reflow : 200 ˚C, MAX. 60 sec 240 ˚C, MAX. 10 sec
3. Slit : 0.3 mm
4. Gap : 1.6 mm

APPLICATIONs
1. CD-ROM drives
2. FDDs