GI1101 Datasheet - General Semiconductor
MFG CO.

General Semiconductor
FEATURES
♦ High temperature metallurgically bonded construction
♦ Glass passivated cavity-free junction
♦ Superfast recovery time for high efficiency
♦ Low forward voltage, high current capability
♦ Capable of meeting environmental standards of MIL-S-19500
♦ Hermetically sealed package
♦ Low Leakage
♦ High surge capability
♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Part Name
Description
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MFG CO.
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
General Semiconductor