GBPC50005TW(2016) Datasheet - GeneSiC Semiconductor, Inc.
MFG CO.

GeneSiC Semiconductor, Inc.
Features
• Integrally molded heat sink provides low thermal resistance
for maximum heat dissipation
• High surge current capability
• Void-free junction soldering by using vacuum soldering
• Universal 3-way terminals: snap on, wire-around, or P.C
board mounting
• High temperature soldering guaranteed: 260°C/ 10
seconds at 5 lbs (2.3 kg) tension
• Not ESD Sensitive
Mechanical Data
Case: Molded plastic with heat sink integrally mounted in the bridge
encapsulation
Terminals: Either nickel plated 0.25". Faston lugs or copper leads
0.040" diameter.
Polarity: Polarrity symbols marked on the body
Mounting position: Bolt down on heat-sink with silicone thermal
compound between bridge and mounting surface
Weight: 19 grams or 0.67 ounces
Mounting torque: 20 inch-lbs max
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