FS25R12W1T4(2009) Datasheet - Infineon Technologies
MFG CO.

Infineon Technologies
Electrical Features
• Low Switching Losses
• Trench IGBT 4
• VCEsat with positive Temperature Coefficient
• Low VCEsat
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• Solder Contact Technology
• Rugged mounting due to integrated mounting
clamps
Typical Applications
• Air Conditioning
• Motor Drives
• Servo Drives
• UPS Systems
Part Name
Description
View
MFG CO.
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies