Part Name
FESB8
Description
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2 Pages
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71.8 kB
MFG CO.
General Semiconductor
FESB8 Datasheet - General Semiconductor
General Semiconductor
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0
♦ Glass passivated chip junction
♦ Low leakage, high voltage
♦ High surge current capability
♦ Superfast recovery time, for high efficiency
♦ High temperature soldering in accordance with CECC 802 / Reflow guaranteed
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MFG CO.
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