FEATURES
   Glass passivated device
   Ideal for surface mouted applications
   Low leakage current
   Metallurgically bonded construction

MECHANICAL DATA
   Case:JEDEC MELF (DO-213AB),molded plastic over
             passivated chip
   Terminals:Solder Plated, solderable per
                   MIL-STD-750, Method 2026
   Polarity: Color band denotes cathode end
   Weight: 0.0046 ounces, 0.116 gram
   Mounting position: Any