Part Name
EFOPM4004E5
Description
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PDF
page
3 Pages
File Size
881.2 kB
MFG CO.
Panasonic Corporation
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EFOPM4004E5 Datasheet - Panasonic Corporation
Panasonic Corporation
Features
Encased in ceramic package
High reliability against soldering heat and mechanical stress
Moisture-proof sealing
Low Profile Type (1.8 mm maximum in thickness)
Designed for reflow soldering
Flat-bottom plate for better mountings
Part Name
Description
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MFG CO.
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