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DF110 Datasheet - Chip Integration Technology Corporation
MFG CO.

Chip Integration Technology Corporation
Features
• Surge overload ratings to 30 amperes peak.
• Recommended for non-automatic applications.
• Ideal for & save space on printed circuit board.
• Applicable for automatic insertion.
• Reliable low cost construction utilizing molded plastic
technology results in inexpensive product.
• Glass passivated chip junctions.
• Suffix "G" indicates Halogen-free part, ex.DF1005G.
• Lead-free parts meet RoHS requirments.
• UL recognized file # E321971
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DF
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : marked on body
• Mounting Position : Any
• Weight : Approximated 0.38 gram
Part Name
Description
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