Part Name
D1A120D
Description
Other PDF
no available.
PDF
page
1 Pages
File Size
26.6 kB
MFG CO.

ETC
Features
Molded epoxy body
DIP type construction with the same terminal pitch as
ICs or TTLs simplifies PC board designing. In addition,
the high sensitivity allows direct driving by TTL, etc.
Automatic insertion compatible
Sealed construction permits automatic flow soldering and cleaning
Magnetic shield is available