Part Name
CP709
Other PDF
PDF
page
2 Pages
File Size
645.2 kB
MFG CO.
Central Semiconductor
CP709(2006) Datasheet - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 41.3 x 41.3 MILS
Die Thickness 9.0 MILS
Base Bonding Pad Area 9.5 x 9.2 MILS
Emitter Bonding Pad Area 12.8 x 10.2 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 18,000Å
Part Name
Description
View
MFG CO.
Power Transistor NPN - Low Saturation Transistor Chip ( Rev : 2003 )
Central Semiconductor
Share Link: 