CP618 Datasheet - Central Semiconductor
MFG CO.
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 21.7 x 21.7 MILS
Die Thickness 9.0 MILS
Base Bonding Pad Area 3.5 MILS DIAMETER
Emitter Bonding Pad Area 3.5 x 3.5 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 10,000Å
Part Name
Description
View
MFG CO.
Small Signal Transistor PNP - Silicon RF Transistor Chip
Central Semiconductor
Small Signal Transistor PNP - Silicon RF Transistor Chip
Central Semiconductor
Small Signal Transistor PNP - Silicon RF Transistor Chip
Central Semiconductor
Small Signal Transistor NPN - Silicon RF Transistor Chip
Central Semiconductor
Small Signal Transistor NPN - Silicon RF Transistor Chip
Central Semiconductor Corp
Small Signal Transistor NPN - RF Transistor Chip ( Rev : 2002 )
Central Semiconductor
Small Signal Transistor NPN - RF Transistor Chip
Central Semiconductor
Small Signal Transistor NPN - RF Transistor Chip
Central Semiconductor Corp
Small Signal Transistor NPN - RF Transistor Chip
Central Semiconductor
Small Signal Transistor NPN - RF Transistor Chip
Central Semiconductor
