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CP617 Datasheet - Central Semiconductor

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Part Name
CP617

Description
Small Signal Transistor PNP - Silicon RF Transistor Chip

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page
2 Pages

File Size
175 kB

MFG CO.
Central-Semiconductor
Central Semiconductor 

PROCESS DETAILS
   Process                              EPITAXIAL PLANAR
   Die Size                             16 x 16 MILS
   Die Thickness                    8.0 MILS
   Base Bonding Pad Area    3.75 x 3.75 MILS
   Emitter Bonding Pad Area 3.75 x 3.75 MILS
   Top Side Metalization         Al - 30,000Å
   Back Side Metalization       Au - 10,000Å


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