Part Name
CP310
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MFG CO.
Central Semiconductor
CP310 Datasheet - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 26 x 26 MILS
Die Thickness 9.0 MILS
Base Bonding Pad Area 6.1 x 4.9 MILS
Emitter Bonding Pad Area 5.2 x 5.2 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 18,000Å
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