Part Name
CP15L50SG
Description
Other PDF
no available.
PDF
page
3 Pages
File Size
462.6 kB
MFG CO.

Chip Integration Technology Corporation
Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Halogen-free part.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-277B.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Weight : Approximated 0.093 grams.