Part Name
C24AG
Description
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PDF
page
4 Pages
File Size
459.6 kB
MFG CO.

Chip Integration Technology Corporation
Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Lead free in compliance with EU RoHS.
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.002 ounce, 0.055 gram