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C0816X7R1C103K Datasheet - TDK Corporation

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Part Name
C0816X7R1C103K

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16 Pages

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983.2 kB

MFG CO.
TDK
TDK Corporation 

C Series – Low ESL Flip Type


FEATUREs
• Positioning the electrodes along the length of the
   chip device, reduces ESR and ESL components over
   conventional products.
• Provides high frequency noise suppression effect
   because the resonating frequency is high.
• Flipped geometry provides low inductance (less
   than 400 pH).
• Provides stabilization of power line voltage.
• Suitable for IC decoupling application.


APPLICATIONs 
• Decoupling CPU power line 
• Bias line in CPU
• High speed digital IC/decoupling
• PC, cell phones, camcorders, etc.


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