BYV4100 Datasheet - Philips Electronics
MFG CO.

Philips Electronics
DESCRIPTION
Rugged glass SOD64 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack
• Also available with preformed leads for easy insertion.
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