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BYD47-18 Datasheet - Philips Electronics

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Part Name
BYD47-18

Other PDF
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page
12 Pages

File Size
62.7 kB

MFG CO.
Philips
Philips Electronics 

DESCRIPTION
Cavity free cylindrical glass SOD87 package through Implotec™ technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Shipped in 8 mm embossed tape
• Smallest surface mount rectifier outline.

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