Part Name
BYD33G
Other PDF
no available.
PDF
page
12 Pages
File Size
65.8 kB
MFG CO.
Philips Electronics
BYD33G Datasheet - Philips Electronics
Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec™ technology. This package is hermetically sealedand fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
Part Name
Description
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MFG CO.
Fast Soft-Recovery Controlled Avalanche Rectifiers
Shenzhen Luguang Electronic Technology Co., Ltd
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