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BYD11G Datasheet - Philips Electronics

BYD11 image

Part Name
BYD11G

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page
7 Pages

File Size
42.2 kB

MFG CO.
Philips
Philips Electronics 

DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
   
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
   

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