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BY527 Datasheet - New Jersey Semiconductor
MFG CO.

New Jersey Semiconductor
DESCRIPTION
Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Lowleakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
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