The BU4SU69 is an ultra-compact IC with one circuit of the bufferless inverter, BU4069UB, built into the SMP package. The single-stage gate configuration enables a short propagation time.

FEATUREs
1) Low current dissipation.
2) Super-mini mold package designed for surface mounting.
3) Wide range of operating power supply voltage.
4) Direct drive of 2 L-TTL inputs and 1 LS-TTL input.