Part Name
BAS85-L1L1G
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3 Pages
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179.7 kB
MFG CO.
TSC Corporation
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BAS85-L1L1G Datasheet - TSC Corporation
TSC Corporation
FEATURES
- Low forward voltage drop
- Ideal for automated placement
- Hermetically sealed glass
- Compression bonded construction
- All external surfaces are corrosion resistant and leads are readily solderable
- Solder hot dip tin (Sn) lead finish
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Description
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