DESCRIPTION
The AM81720-012 is designed specifically for Telecommunications applications.
The device is capable of withstanding any mismatch load condition at any phase angle (VSWR ∞:1) under full rated conditions. The unit is an overlay, emitter site ballasted, geometry utilizing a refractory/gold metallization system.
The unique AMPAC™ devices are housed in Hermetic Metal/Ceramic packages with internal Input/Output matching structures.

■ REFRACTORY/GOLD METALLIZATION
■ EMITTER SITE BALLASTED
■ RUGGIZED VSWR ∞:1
■ LOW THERMAL RESISTANCE
■ INPUT/OUTPUT MATCHING
■ OVERLAY GEOMETRY
■ METAL/CERAMIC HERMETIC PACKAGE
■ POUT = 12 W MIN. WITH 7.4 dB GAIN