New Micro-USB interconnect solutions set standard for sleeker mobile devices

USB Implementers Forum, Inc. (USB-IF) has finalized the specification of the Micro-USB technology in early January 2007. The development of this new connector technology has given the opportunity for portable device and mobile phone makers to further reduce their real estate in their applications. The Micro-USB will replace most of the Mini-USB plugs and receptacles that are currently being used. The specification of the Micro-USB supports the current USB On-The-Go (OTG) supplement. This allows communication between portable devices without going through a host. Being much smaller than the Mini-USB, the Micro-USB is the choice of interconnect solution of mobile phone makers such as Nokia and Motorola for their new phone designs.

FEATUREs and Benefits
• Wider side solder tabs provide improved solder retention
• Stainless steel shell (0.3mm thick) provides high mating durability & strength
• Lead-in features provide blind mate
• Fold-down tabs provide high housing retention
• Latching windows with angular tabs prevent accidental unmating of plug
• Beveled profile ‘B’ style to lock out ‘A’-type plug
• Unique laser-welded shield design strengthen wrenching strength during use
• Pick & place area (3mm diameter) enhances assembly process
• Rear shield for EMI protection (for standard mount)