21-0136F Datasheet - Maxim Integrated
MFG CO.
Maxim Integrated
PACKAGE OUTLINE 12, 16L THIN QFN, 3x3x0.8mm
Part Name
Description
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MFG CO.
PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm
Maxim Integrated
PACKAGE OUTLINE, 40L THIN QFN 5x5x0.8mm BODY / 0.4mm LEAD PITCH
Dallas Semiconductor -> Maxim Integrated
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
Dallas Semiconductor -> Maxim Integrated
PACKAGE OUTLINE, 8L, 14L,16L, SOIC .150 INCH
Maxim Integrated
TSSOP (Thin-Shrink Small Outline Package) Family
Elantec -> Intersil
Package Outline
Global Mixed-mode Technology Inc
Package Outline
Global Mixed-mode Technology Inc
Package Outline
Global Mixed-mode Technology Inc
Package Outline
Global Mixed-mode Technology Inc
Package outline
Philips Electronics
