1N58011 Datasheet - Microsemi Corporation
MFG CO.
Microsemi Corporation
FEATURES:
· Chip Outline Dimensions: 68 x 68 mils
· Chip Thickness: 8 to 12 mils
· Anode Metallization: Aluminum
· Metallization Thickness: 70,000ÃNominal
· Bonding Area: 42 x 42 mils Min.
· Back Metallization: Gold-3000ÃNominal
· Junction Passivated with Thermal Silicon Dioxide - Planar Design
· Backside Available with Solderable Ag Backside as JANHCF or JANKCF
Part Name
Description
View
MFG CO.
6 AMPS FAST RECOVERY RECTIFIER CHIP 50 - 150 VOLTS ( Rev : 1999 )
Microsemi Corporation
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Microsemi Corporation
6 AMPS 50-400 VOLTS 120 nsec FAST RECOVERY RECTIFIER
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Shanghai Lunsure Electronic Tech
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6 Amp Fast Recovery Rectifier 50 to 1000 Volts ( Rev : 2009 )
Micro Commercial Components
6 Amp Fast Recovery Rectifier 50 to 1000 Volts
Micro Commercial Components
6 Amp Fast Recovery Rectifier 50 to 1000 Volts
DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
