Part Name
1N4001ID
Description
Other PDF
no available.
PDF
page
5 Pages
File Size
27.5 kB
MFG CO.

Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.