UPD705100 View Datasheet(PDF) - NEC => Renesas Technology

Part Name

Description

MFG CO.

UPD705100

V830™ 32-BIT MICROCONTROLLER

NEC => Renesas Technology 

µPD705100

15. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the µPD705100.

For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting

Technology Manual (C10535E).

Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under

different conditions.

Table 15-1. Soldering Conditions for Surface-Mount Devices

Soldering process

Infrared ray reflow

VPS

Partial heating method

Soldering conditions

Symbol

Peak package’s surface temperature: 235 °C

Reflow time: 30 seconds or less (210 °C or more)

Maximum allowable number of reflow processes: 2

Exposure limit: 3 daysNote (10 hours of pre-baking is required at 125 °C

afterward)

<Caution>

Non-heat-resistant trays, such as magazine and taping trays, cannot be

baked before unpacking.

IR35-103-2

Peak package’s surface temperature: 215 °C

Reflow time: 40 seconds or less (200 °C or more)

Maximum allowable number of reflow processes: 2

Exposure limit: 3 daysNote (10 hours of pre-baking is required at 125 °C

afterward)

<Caution>

Non-heat-resistant trays, such as magazine and taping trays, cannot be

baked before unpacking.

VP15-103-2

Terminal temperature: 300 °C or less

-

Heat time: 3 seconds or less (for one side of a device)

Note Maximum number of days during which the product can be stored at a temperature of 25 °C and a relative

humidity of 65 % or less after dry-pack package is opened.

Caution Do not apply two or more different soldering methods to one chip (except for partial heating

method for terminal sections).

62

Share Link: