MB39C022G/J/L/N
6. Absolute Maximum Ratings
Parameter
Symbol
Condition
Rating
Min
Max
Power supply voltage
VIN1
VIN1 pin
− 0.3
+ 6.0
VIN2
VIN2 pin
− 0.3
VIN1 + 0.3
Input voltage
VFB
FB pin
− 0.3
VIN1 + 0.3
VEN1
EN1 pin
− 0.3
+ 6.0
VEN2
EN2 pin
− 0.3
+ 6.0
POR pull-up voltage
VPOR
POR pin
− 0.3
+ 6.0
LX voltage
VLX
LX pin
− 0.3
VIN1 + 0.3
LX peak current
ILX
LX pin AC
–
1.6
VOUT2 peak current
IO2
VOUT2 pin AC
–
0.8
Power dissipation
PD
Ta ≤ + 25°C
–
2632*1, *2
–
980*1, *3
Ta = + 85°C
–
1053*1, *2, *4
–
392*1, *3, *4
Storage temperature
TSTG
–
− 55
+ 125
*1: When mounted on four layer epoxy board of 11.7 cm × 8.4 cm
*2: At connect the exposure pad and with thermal via (Thermal via 4 pcs).
*3: At connect the exposure pad and not thermal via.
*4: Power dissipation value between + 25°C and + 85°C is obtained by connecting these two points with a straight line
Unit
V
V
V
V
V
V
V
A
A
mW
°C
Notes:
• The use of negative voltages below − 0.3 V to the GND pin may create parasitic transistors on LSI lines, which can cause
abnormal operation.
• If LX terminal is short-circuited to VIN1 or VIN2 or GND line, there is a possibility to destroy it. Such usage is prohibit
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Document Number: 002-08460 Rev. *C
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