datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

LTC6990 View Datasheet(PDF) - Analog Devices

Part Name
Description
MFG CO.
LTC6990 Datasheet PDF : 30 Pages
First Prev 21 22 23 24 25 26 27 28 29 30
PACKAGE DESCRIPTION
LTC6990
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715 Rev A)
0.70 ±0.05
3.55 ±0.05
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
1.35 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.00 ±0.10
(2 SIDES)
R = 0.115
R = 0.05
TYP
TYP
4
0.40 ±0.10
6
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10 1.65 ±0.10
(2 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
3
1
(DCB6) DFN 0405
0.25 ±0.05
0.50 BSC
1.35 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
For more information www.analog.com
Rev. D
27

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]