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LTC6990IDCB-TRPB View Datasheet(PDF) - Analog Devices

Part Name
Description
MFG CO.
LTC6990IDCB-TRPB
ADI
Analog Devices 
LTC6990IDCB-TRPB Datasheet PDF : 30 Pages
First Prev 21 22 23 24 25 26 27 28 29 30
LTC6990
APPLICATIONS INFORMATION
SUPPLY BYPASSING AND PCB LAYOUT GUIDELINES
The LTC6990 is a 2.2% accurate silicon oscillator when
used in the appropriate manner. The part is simple to use
and by following a few rules, the expected performance
is easily achieved. The most important use issues involve
adequate supply bypassing and proper PCB layout.
Figure 17 shows example PCB layouts for both the SOT-23
and DCB packages using 0603 sized passive components.
The layouts assume a two layer board with a ground plane
layer beneath and around the LTC6990. These layouts are
a guide and need not be followed exactly.
1. Connect the bypass capacitor, C1, directly to the V+ and
GND pins using a low inductance path. The connection
from C1 to the V+ pin is easily done directly on the top
layer. For the DCB package, C1’s connection to GND
is also simply done on the top layer. For the SOT-23,
OUT can be routed through the C1 pads to allow a good
C1 GND connection. If the PCB design rules do not
allow that, C1’s GND connection can be accomplished
through multiple vias to the ground plane. Multiple
vias for both the GND pin connection to the ground
plane and the C1 connection to the ground plane are
recommended to minimize the inductance. Capacitor
C1 should be a 0.1µF ceramic capacitor.
2. Place all passive components on the top side of the
board. This minimizes trace inductance.
3. Place RSET as close as possible to the SET pin and
make a direct, short connection. The SET pin is a cur-
rent summing node and currents injected into this pin
directly modulate the operating frequency. Having a
short connection minimizes the exposure to signal
pickup.
4. Connect RSET directly to the GND pin. Using a long path
or vias to the ground plane will not have a significant
affect on accuracy, but the direct, short connection is
recommended and easy to apply.
5. Use a ground trace to shield the SET pin. This provides
another layer of protection from radiated signals.
6. Place R1 and R2 close to the DIV pin. A direct, short
connection to the DIV pin minimizes the external signal
coupling.
V+
R1
R2
C1
V+
DIV
SET
RSET
OE
OUT
LTC6990
GND
V+
SET
DIV
RSET
C1
0.1µF
V+
R1
R2
C1
V+
OUT
OE
OUT
GND
GND
V+
OE
SET
DIV
R1
RSET
R2
DCB PACKAGE
TSOT-23 PACKAGE
6990 F17
Figure 17. Supply Bypassing and PCB Layout
For more information www.analog.com
Rev. D
21

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